EDELTEQ HOLDINGS BERHAD

KLSE: 0278 (EDELTEQ)

最近更新时间: 2天之前, 3:41AM

0.490

-0.05 (-8.41%)

前收盘价格 0.535
收盘价格 0.535
成交量 8,224,600
平均成交量 (3个月) 4,699,250
市值 287,036,704
市盈率 (P/E TTM) 49.00
价格/销量 (P/S) 1.17
股市价格/股市净资产 (P/B) 4.63
52周波幅
0.170 (-65%) — 0.565 (15%)
股息率 (DY TTM) 0.41%
营业毛利率 3.69%
营业利益率 (TTM) 4.20%
稀释每股收益 (EPS TTM) 0.010
季度收入增长率 (YOY) 1,059.80%
季度盈利增长率 (YOY) 43.00%
总债务/股东权益 (D/E MRQ) 10.91%
流动比率 (MRQ) 1.20
营业现金流 (OCF TTM) 22.53 M
杠杆自由现金流 (LFCF TTM) 11.10 M
资产报酬率 (ROA TTM) 2.57%
股东权益报酬率 (ROE TTM) 9.33%

市场趋势

短期 中期
行业 Semiconductors (MY) 混合的 看跌
Semiconductors (全球的) 看涨 看涨
股票 EDELTEQ - -

AIStockmoo 评分

0.1
分析师共识 0.0
内部交易活动 NA
价格波动 -5.0
技术平均移动指标 1.5
技术振荡指标 4.0
平均 0.13

相关股票

股票 市值 DY P/E(TTM) P/B
EDELTEQ 287 M 0.41% 49.00 4.63
MPI 6 B 1.16% 39.22 2.99
UNISEM 6 B 2.34% 114.00 2.48
OPPSTAR 321 M - - 2.75
GTRONIC 213 M - 15.75 0.810
KESM 149 M 1.73% - 0.490

Edelteq Holdings Bhd is an investment holding company and through its subsidiaries, it is principally involved in the provision of engineering support for IC assembly and test processes in the semiconductor industry. The company is a semiconductor manufacturing solutions provider. It operates in three segments: Semiconductor Consumables and Materials (SCM) that involves Design and assembly of IC burn-in boards and supply of PCB, supply and refurbishment of IC assembly and test consumables and trading of industrial material; Semiconductor Equipment and Automation (SEA) Design, development, assembly of ATE and factory automation and Investment holding segment. SCM segment derives maximum revenue for the company.

部门 Technology
行业 Semiconductors
投资方式 Small Growth
内部持股比例 79.36%
机构持股比例 3.76%

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日期 类型 细节
22 Oct 2025 公告 Changes in Sub. S-hldr's Int (Section 138 of CA 2016) - MR CHIN YUEN FONG
10 Oct 2025 公告 Notice of Interest Sub. S-hldr (Section 137 of CA 2016) - ICAPITAL.BIZ BERHAD
10 Oct 2025 公告 NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING
10 Oct 2025 公告 General Meetings: Outcome of Meeting
09 Oct 2025 公告 Additional Listing Announcement /Subdivision of Shares
30 Sep 2025 TheEdge PPB, Maybank, Vantris Energy, Gamuda, Haily, Capital A, AAX, Aeon Credit, Kim Loong Resources, Crescendo, Country Heights, Mayu Global, Edelteq
30 Sep 2025 公告 NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING
29 Sep 2025 公告 NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING
29 Sep 2025 TheEdge Edelteq forms JV for optical inspection systems, gets state backing
26 Sep 2025 公告 CIRCULAR TO SHAREHOLDERS IN RELATION TO THE:- (I) PROPOSED INVESTMENT FOR A TOTAL OF 261,100 SOLID POINT SHARES REPRESENTING 24.00% OF THE ENLARGED ISSUED SHARES OF SOLID POINT FOR A TOTAL PURCHASE CONSIDERATION OF RM20,736,000 TO BE SATISFIED VIA CASH; AND (II) PROPOSED DIVERSIFICATION OF THE COMPANY'S EXISTING PRINCIPAL ACTIVITIES TO INCLUDE THE MANUFACTURING OF PRECISION MACHINING COMPONENTS AND PARTS, IN CONJUNCTION WITH THE PROPOSED INVESTMENT (COLLECTIVELY REFERRED TO AS THE "PRO
25 Sep 2025 公告 General Meetings: Notice of Meeting
24 Sep 2025 公告 NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING
23 Sep 2025 TheEdge Edelteq plans placement to raise nearly RM20 mil for working capital, repay borrowings
23 Sep 2025 公告 NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING
23 Sep 2025 TheEdge Apollo, IGB REIT, Southern Cable, JS Solar, OM Holdings, Kuchai Development, TXCD, Chin Hin Group Property, Edelteq
22 Sep 2025 公告 DEALINGS IN LISTED SECURITIES (CHAPTER 14 OF LISTING REQUIREMENTS) : Dealings Outside Closed Period
12 Sep 2025 公告 TRANSACTIONS (CHAPTER 10 OF LISTING REQUIREMENTS) : NON RELATED PARTY TRANSACTIONS
11 Sep 2025 公告 PROPOSED ISSUANCE OF UP TO 10,666 NEW REDEEMABLE CONVERTIBLE CUMULATIVE PREFERENCE SHARES ("RCCPS") AT AN ISSUE PRICE OF RM300 PER RCCPS BY HALOVISION SYSTEM SDN. BHD. ("HALOVISION" OR THE "JV COMPANY") AND ALLOTMENT OF 2 ORDINARY SHARES AT AN ISSUE PRICE OF RM100 PER ORDINARY SHARE IN HALOVISION, A JOINT VENTURE CORPORATION BETWEEN EDELTEQ VENTURES SDN. BHD. AND HALO TECHNOLOGIES SDN. BHD., TO KUMPULAN MODAL PERDANA SDN. BHD. ("KMP") ("PROPOSED ISSUANCE")
25 Aug 2025 公告 Quarterly rpt on consolidated results for the financial period ended 30/06/2025
07 Aug 2025 公告 MULTIPLE PROPOSALS
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股息率 (DY TTM) 0.41%
股息支付比率 22.47%
预计下次股息支付 Apr 2026
除息日 公告日期 支付日期 详情
27 Mar 2025 24 Feb 2025 15 Apr 2025 0.002 现金

每年股息收益率

年份 每年总股息 ($) 频率/年份 收益率 %
2025 0.002 1 0.41

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风险概况

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适度保守
中等
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部分利润 (TP1)
目标利润 (TP2)
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停止损失价格 (SL)

52周波幅范围
 
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